The ICCAD Executive Committee has recognized “3D-ICE: Fast Compact Transient Thermal Modeling for 3D ICs with Inter-Tier Liquid Cooling” as “the most influential on research and industrial practice in computer-aided design of integrated circuits over the ten years since its original appearance at ICCAD.” The authors of the paper are Arvind Sridhar, Alessandro Vincenzi, Martino Ruggiero, David Atienza (all from the Embedded Systems Laboratory – ESL at EPFL), and Thomas Brunschwiler (IBM Zurich Research Laboratory).
- Qualcomm Fellowship for Sid Gupta September 21, 2021
- Registration for the Cloud Sustainability Days 2021 August 26, 2021
- Sustainability Days 2021 Program August 3, 2021
- EcoCloud organizes Cloud Sustainability Days 2021 June 28, 2021
- A paradigm shift in virtual memory use: Midgard June 24, 2021